테스트 그리드를 구비하는 웨이퍼-리페어 설비

Wafer-repair apparatus having test grid

Abstract

테스트 그리드(test grid)를 척 상면에 수평하게 배치할 수 있는 웨이퍼-리페어 설비에 관해 개시한다. 테스트 그리드를 척 상면에 수평으로 정렬시키는 툴을 더 구비함으로써, 여러번의 수작업 없이 테스트 그리드를 신속하게 척 상면에 수평 정렬시킬 수 있다.
PURPOSE: Wafer-repair equipment including a test grid is provided to easily perform a process and to shorten an interval of delay time caused by a manual operation by installing a tool for horizontally aligning the test grid on the surface of a chuck. CONSTITUTION: Horizontal and vertical lattice lines are formed in the test grid(120). The test grid is placed on the chuck(110). The wafer-repair equipment includes the test grid, the chuck and laser. The tool(210) for horizontally aligning the test grid on the upper surface of the chuck is installed in the chuck. The tool can be installed/uninstalled in/from the chuck.

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